Overkill cooling, because physics

{
  "input": {
    "prompt": " Close-up photo/illustration of the thermal solution inside the device: copper heat spreader/heat pipe, thermal pads, and a compact blower or small fan (if present) plus venting in the 3D-printed shell. Include arrows/callouts indicating airflow path and where heat is moved away from CPU. Visual tone: “absurdly serious engineering in a phone.”"
  }
}